MANUFACTURING
SMT Technologies
High-precision SMT production for fine-pitch and high-density electronic assemblies.
- Support until 01005 above chip size
- 0.5mm Pitch Micro BGA, CSP, QFN
- 0.5mm Pitch 150mm Long connector
- Minimum chip spacing 0.2mm
- Using ASM Siplace
Injection Molding
Automated injection molding facilities supporting a wide range of tonnage for precision plastic parts.
- Machine tonnage from 20 tone until 460 tone
- Main injection machine brand Sumitomo, Nissei & Toshiba
- Robotic Arm system apply
Secondary Process (Spraying)
Controlled secondary spraying processes performed in clean room environments to ensure consistent finish and quality.
- Spraying booth clean room control
- Spraying inspection area
- Both area 10k clean room control with ISO certify
Complex Box Build Assembly / System Integration
Comprehensive box build assembly and system integration for multi-component electronic systems.
- Able handle complex product assembly